Relequa launches Moisture Profiling software update for metal AM powder moisture testing

March 4, 2021

Relequa has updated the Moisture Profiling software in its MP-1000 system for running in Additive Manufacturing moisture testing mode (Courtesy Relequa Analytical Systems)

Relequa Analytical Systems, a developer of moisture analysis instruments headquartered in Dungarvan, Co Waterford, Ireland, has announced an update to the Moisture Profiling™ software in its MP-1000 system to test for the presence of moisture in metal Additive Manufacturing powders, and to research their behaviour in the environment of AM processes.

Founded in 2009, Relequa is committed to researching moisture behaviour to provide its customers with innovative products for moisture analysis. It specialises in moisture problem-solving systems for the pharmaceutical industry, moisture profiling analytical systems, moisture ingress studies for packaging, rapid moisture test and moisture testing of AM metal powders.

The company states that its technology does not use heat or sample weight as proxy measurements of moisture. Instead, based fundamentally on Water Activity the technology measures moisture being directly released from the metal powder. No sample preparation is needed, the test is non-destructive and powders are tested directly within the AM process area avoiding sample handling and storage issues.

Dr Peter Moir, moisture expert consultant and CEO of Relequa, recently presented at the INVIRTA workshop: ‘Special Insight in Metallic Powder Characterisation’. Data was delivered showing how unique metal powders are in their moisture interaction behaviour. Relequa’s updated Moisture Profiling protocol was shown to distinguish between different metal AM alloy powders.

Further information about the updated Moisture Profiling software is available via the company website.

www.relequa.com

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