Materialise, Leuven, Belgium, has licensed Siemens’ Parasolid® software for integration with Magics, the company’s software for data and build preparation. With Parasolid technology, Materialise will add native CAD workflows within Magics 26, providing an additional toolset on top of mesh functionality. This powerful combination of trusted solutions will allow users to continue iterating CAD designs in Magics to prepare for Additive Manufacturing processes, improving productivity and providing cleaner, more accurate and fit-for-purpose data.
“For years, the 3D printing industry has discussed whether CAD or mesh is the preferred workflow for file preparation,” stated Stefaan Motte, vice president Software for Materialise. “We believe both offer unique benefits and a seamless integration of both formats will provide users with the optimal workflow.”
Magics 26 will enable users to seamlessly transition from design optimisation in CAD to mesh-based file preparation. This will enable users to easily review and edit parts with designers and engineers who are familiar with CAD systems before transitioning to mesh for platform and build preparation.
Developed by Siemens Digital Industries Software, Parasolid is said to be the world’s premier 3D geometric modelling kernel. It is at the core of the Siemens’ Xcelerator portfolio’s open and flexible ecosystem and has been adopted by more than 200 software vendors giving end-users 100% 3D model compatibility across 350+ Parasolid-based software applications.
Convergent ModelingTM technology, a core part of the Parasolid solution, enables mesh data to be mixed with traditional CAD geometry in a unified environment, removing the need for time-consuming and error-prone data translation and enabling intelligent operations to be carried out. Magics users will benefit from the best of both worlds – CAD for part editing using best-in-class technology and mesh-based operations for platform preparation using tried-and-true solutions.
Magics 26 is scheduled to be released in spring 2022.