Velo3D adds further eight locations for its international roadshow
April 28, 2023
Velo3D, Campbell, California, USA, has expanded its 2023 Proof is in the Printing Additive Manufacturing roadshow series with a further eight events located across Asia and Europe. The workshops are intended to educate engineers on how AM can transform business and achieve high-volume production, and will also show how users can qualify AM parts for use in real-world environments.
“Our 2023 tour will help engineers understand how they can incorporate 3D printing into their standard manufacturing workflows and workforces without needing extensive specialisation, like a Ph.D. in Additive Manufacturing,” stated Renette Youssef, Velo3D Chief Marketing Officer. “Last year’s events visited a few countries in Europe and Asia and focused on educating customers and prospects on the latest advancements in metal additive manufacturing. Based on the interest in and success of those shows, we’ve expanded the number of events outside of the US to educate new engineers in new industries on how to achieve reproducible, predictable outcomes for scalability.”
The workshops are half-day events and free to attend. Those interested can register to attend online. Dates and locations for the European and Asian legs of the tour include:
- Augsburg, Germany: May 3, 2023
- Midlands, UK: May 16, 2023
- Stavanger, Norway: May 24, 2023
- Toulouse, France: June 1, 2023
- Tokyo, Japan: June 2023
- Busan, Korea: June 2023
- Augsburg, Germany: September 26, 2023
- Bern, Switzerland: September 2023
Over the past two years, Velo3D has been steadily growing its presence in Asia and Europe; the company opened its European Technology Center in Augsburg in June 2022. Growing into these new regions has reportedly allowed Velo3D to capitalise on the growing interest in its fully integrated metal Additive Manufacturing solution, which combines software, hardware, and underlying manufacturing processes to simplify the Additive Manufacturing of complex, high-performance parts.
