Tekna to consolidate European metal powder production into French facility
Tekna Holding AS, Sherbrooke, Quebec, Canada, has announced plans to consolidate its European metal Additive Manufacturing powder production into one new facility in Pont-de-Veyle, France. In a move hoped to strengthen its supply chain resilience, the company has signed a nine-year lease on the facility.
The 8,000 m2 building is designed to hold up to 1,500 tons of powder manufacturing capacity for the production of nickel, aluminium and titanium powders. The facility also allows for further expansion of production capacity and for integrating printed electronics and energy storage activities at a later stage.
The plant is part of Tekna’s ten-year business plan – launched in 2021 – to develop and accelerate growth in all three of its powder business segments. This facility enables the company to be closer to its portfolio of European customers, including previously announced and upcoming long-term supply agreements signed with major aerospace OEMs.
“This facility will be the centrepiece of a supply chain that is 100% European-based, ranging from feedstock procurement to manufacturing of advanced powders, and delivery to point-of-use, with fully traceable, closed-loop material recycling,” stated Luc Dionne, CEO. “Tekna’s ambition to enable a green economy through the efficient use of resources and the elimination of waste is taking shape. We are strengthening the company’s supply chain resilience, reducing our carbon footprint and enabling the industry to operate in a circular economy.”
Between this new facility and the recently announced production facility for the printed electronics segment in Sherbrooke, Tekna will have created space to grow production capacity by approximately 2,500 tons of powder annually.
The lease agreement at the Pont-de-Veyle facility starts in January 2022 and comes with the possibility of termination after six months, and subsequently every three years. Tekna has the option to expand the leased area to 33,000 m2.
