Tekna appoints semiconductor industry veteran Claude Jean as new CEO
Tekna Holding ASA, Sherbrooke, Quebec, Canada, has announced that Claude Jean has been appointed as the new CEO of the Tekna Group, effective April 28, 2025.
Jean is an accomplished senior technology executive with a proven track record of building and leading world-class electronic manufacturing services and R&D. He joins Tekna from Teledyne Technologies where he has held several leading positions including Executive Vice President, Strategy & Partnership, Semiconductor and as General Manager of Teledyne DALSA, an international leader in high-performance digital imaging and semiconductors.
“I am happy to announce the appointment of Claude as the new CEO of Tekna. He is well known in the industry for driving business results and maximising profitability through the delivery of exceptional product quality, service and effective management of people, technology, processes and financial resources. I am confident that he will further strengthen the great platform of Tekna and ensure that we bring the company to the next level. His extensive background from the semiconductor industry will also be valuable as we progress with our nano nickel project for MLCC production,” Dag Teigland, Chair of the Board of Tekna Holding ASA, shared.
Claude Jean stated, “It is an honour for me, and I am excited to take over as CEO of this impressive high-tech company. Together with the highly competent Tekna team I am looking forward to executing on its strategy and growth plan to increase value for our customers and shareholders.”
“The Board would like to thank current CEO Luc Dionne for leading Tekna through a period of strategic growth in a very dynamic era for the Additive Manufacturing industry. Since 2014, Tekna has grown its strong plasma technology foundations to a leading provider of advanced materials and plasma solutions to several industries – serving the most demanding customers within aerospace, defence, medical and microelectronics,” Teigland added.
Jean holds an MSc in Physics and an MBA Degree from the University of Sherbrooke, Canada. He has over 30 years of experience in the semiconductor and digital imaging sectors. His leadership capabilities include transforming product lines for profitability, enhancing operational efficiency, and driving R&D initiatives with a deep technical understanding.
