The Natural Sciences and Engineering Research Council of Canada (NSERC)’s network for Holistic Innovation in Additive Manufacturing (HI-AM) reports that its 3rd HI-AM Conference, which was scheduled to take place at McGill University, Montreal, Canada, on June 25–26, 2020, will now be delivered as a digital conference due to coronavirus (COVID-19).
In an offical statement, the organisers wrote, “We have been closely monitoring the evolving situation with the COVID-19 outbreak over the past few weeks. After careful consideration, the HI-AM Board of Directors and Conference Organizing Team have decided there will be no physical event for HI-AM 2020 and the conference will be delivered in an online format.”
“Our team is working hard at the logistics involved to moving the conference online,” the statement continued. “Presentation instructions, new submission deadlines and updated conference dates and programme are posted online as soon as they become available.”
There will be no cost to join the online conference,but registration is mandatory to assist with planning. The registration link for the digital HI-AM 2020 will be provided in the coming weeks. For those who have already registered for HI-AM 2020, it was stated that the registration fee will be automatically refunded.
“We look forward to meeting you online in June 2020, and hope we can welcome the AM community to our 4th Conference in Halifax, Nova Scotia, Canada, in June 1–2, 2021 after the pandemic ends,” concluded the organisers.
Further information and registration details are available via the event website.