Digital Metal and Etteplan agree partnership to advance transition to AM

September 30, 2021

Left to right: Christian Lönne, CEO at Digital Metal; Riku Riikonen, SVP, Engineering Solutions, Etteplan; and Tero Hameenaho, Department Manager, Additive Manufacturing & Optimization at Etteplan (Courtesy Digital Metal)

Digital Metal, part of Sweden’s Höganäs Group, and global engineering company Etteplan, Espoo, Finland, have announced that they will enter a strategic partnership to offer guidance to existing and new customers looking to make the transition to Additive Manufacturing.

The companies aim to provide design optimisation solutions for Digital Metal’s Binder Jetting (BJT) processes, and to offer manufacturing companies the full benefit of the technology – from idea to complete component with volume production in mind.

“Together with Etteplan we will be able to offer a stronger value proposition, covering a complete design and manufacturing process, to our customers,” stated Christian Lönne, CEO at Digital Metal. “The partnership gives us access to a world-class design team that complements our business very well.”

Etteplan provides solutions for software and embedded solutions, industrial equipment and plant engineering and technical documentation solutions to leading companies in the manufacturing industry. In 2020, it had a turnover of approximately €260 million and currently has over 3,500 employees.

The companies explain that by combining Digital Metal’s expertise in BJT with Etteplan’s knowledge in the design of components for AM, their goal is to accelerate the transition from traditional manufacturing to Additive Manufacturing.

Riku Riikonen, SVP, Engineering Solutions, Etteplan, commented, “Etteplan has invested heavily in Additive Manufacturing and has been involved in groundbreaking engineering already for a long time. We look forward to exploring and create synergies together with Digital Metal. The partnership will strengthen both Etteplan’s as well as Digital Metal’s offerings towards existing and future customers.”

In the latest issue of Metal AM magazine

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Extensive AM industry news coverage, as well as the following exclusive deep-dive articles:

  • What happens when you take the powder out of AM? Charting the rise of wire-based DED with WAAM3D
  • Smart sensor-integrated parts by AM: A look at a novel possibility with industrial applications
  • Tailored materials for AM: How a 'powder kit' can achieve greater material diversity with fewer resources in PBF-LB
  • QuesTek's ICMD: Faster, cheaper, and better alloy development for Additive Manufacturing
  • NanoAL: Alloy development on an open parameter PBF-LB machine, from installation through to Rapid Alloy Screening
  • Using the Six Sigma method to optimise metal powder spreading in PBF-LB
  • Insights from R&D to part production: How CT analysis can advance metal Binder Jetting
  • Corrosion and wear resistence of materials processed by beam-based AM technologies

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