HI-AM 2026 Conference extends abstract submission deadline
The organisers of the HI-AM Conference 2026, hosted by the University of Waterloo, Ontario, Canada, have announced that the deadline for abstracts has been extended. HI-AM 2026, scheduled to take place from June 22-23, 2026, in Banff, Canada, aims to bring together industry and academic leaders to discuss current challenges and emerging directions in Additive Manufacturing.
The HI-AM Conference invites submissions focused on AM. While the primary focus areas are listed below, submissions on related topics outside this scope may be considered on a case-by-case basis.
- Additive Manufacturing technologies: Laser Beam Powder Bed Fusion (PBF-LB), Electron Beam Powder Bed Fusion (PBF-EB), Directed Energy Deposition (laser, electron beam, arc-based), Cold Spray and solid-state AM, Binder Jetting, material jetting, material extrusion, vat photopolymerisation, hybrid processes
- Materials for AM and material-specific process development: metals, polymers, ceramics, composites, biomaterials, functional and advanced materials, multi-material systems
- Design for Additive Manufacturing (DfAM)
- Material, process, and component modelling
- Metrology, control, and quality assurance
- Characterisation and post-processing
- Additive Manufacturing applications: aerospace, automotive, medical and biomedical, energy and natural resources, consumer products
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The new deadline is February 6, 2026. Those interested can submit their abstracts here.
