SAP has announced the opening of the early access programme for its Distributed Manufacturing application to new customers as part of its joint collaboration with the global logistics giant, UPS.
The SAP Distributed Manufacturing early access program intends to provide discrete manufacturers, industrial Additive Manufacturing companies and service providers, materials providers, postal companies and global logistics networks with standard and scalable business processes for digitising, approving, certifying and manufacturing digital parts in an end-to-end digital manufacturing process. The program is part of the SAP Leonardo IoT portfolio.
SAP is currently working with thirty co-innovation companies in the program, and is expanding the initiative to offer more organisations the ability to test and approve 3D printing before the anticipated general availability of the new application from SAP planned for later this year.
Participating companies can explore opportunities to drive innovation by rethinking product design, optimising manufacturing and logistics processes, and creating new business models. They can “right size” their inventory for slow-moving parts while meeting time-sensitive customer needs, take advantage of opportunities to easily produce unique custom goods, and improve production consistency with high-quality, low-cost certified parts.
“This SAP program is a perfect fit for us,” stated Nikolai Zaepernick, senior Vice President, EOS Central Europe. “It provides an ideal collaboration platform to merge supply and demand for the industrial 3D printing technology we offer. As a leader in this field, EOS contributes a wealth of deep and long-standing technology experience. The platform, on the other hand, enables us to integrate our technology into existing supply chains and production environments on the way to becoming an established way of manufacturing.”