Nidec rebrands Additive Manufacturing division
Nidec Machine Tool America, located in Wixom, Michigan, USA, has announced the rebranding of its Additive Manufacturing division to Advanced Manufacturing Technologies, reflecting the company’s commitment to delivering precision manufacturing solutions across North America.
“This expansion reflects where the industry is heading and where we stand as a company,” said Tyson Gregory, Advanced Manufacturing Technologies Sales Manager. “By bringing these specialised systems together, we are making it easier for our North American customers to leverage our full suite of solutions.”
The newly named division now brings three distinct technology platforms under one umbrella: LAMDA, ABLASER, and BOND MEISTER.
LAMDA – DED AM System
LAMDA is Nidec’s Laser Powder DED Additive Manufacturing system, built for large-scale metal AM. The series, comprising the LAMDA200, LAMDA500, LAMDA2000, and LAMDA5000, features advanced process control with AI anomaly detection for real-time monitoring and feedback, which is intended to ensure stability and repeatability throughout the build. Additionally, its local shield nozzle enables the Additive Manufacturing of reactive materials without a full inert gas enclosure, which is intended to simplify setup and speeds up delivery.
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ABLASER – Laser Micromachining System
The ABLASER is built around proprietary optical head technology and a prism rotator. This is intended to enable ultra-high precision helical machining, drilling micro-holes down to ⌀27 μm in materials like silicon, SiC, and ceramics with no thermal distortion. Its flexible taper hole control supports straight, forward taper, reverse taper, and hand-drum-shaped geometries.
BOND MEISTER – Room Temperature Wafer Bonding Machine
BOND MEISTER joins wafers through surface activation bonding inside a high-vacuum environment; no heat is required. This reportedly eliminates thermal stress and distortion, allowing for the bonding of dissimilar materials like GaN, GaAs, and silicon. The lineup includes the MWB-04/06-R for research, prototyping, and small to medium volume production; MWB-04/06/08-AX for high-throughput production with fully automated cassette-to-cassette operation; and MWB-08/12-ST for 300 mm wafer bonding in high-volume applications.
www.nidec-machinetoolamerica.com
