Materialise and Nikon SLM co-develop integrated data preparation workflow

Nikon SLM Solutions AG, based in Lübeck, Germany, and Materialise, headquartered in Leuven, Belgium, have partnered to create a fully integrated data preparation workflow targeted at scaling from new product integration (NPI) to full series production through the combination of the companies’ software, including build layout, toolpath generation, laser allocation, and machine parameters.

“Advanced manufacturers are sending a clear message: scaling from NPI to series production demands both flexibility and validation,” stated Brigitte de Vet, CEO of Materialise. “Together with Nikon SLM, we’re building an integrated build processor that connects seamlessly from leading CAD/CAM systems such as Magics, Siemens, and PTC to fully build-ready job files, with no need to add machine-dependent information. By combining deep customisation with OEM validation, we’re giving manufacturers the confidence to scale to repeatable series production.”

The collaboration is intended to address key production pain points: fragmented workflows, lack of validation, and limited customisation options. For aerospace, defence, and advanced manufacturing customers, the companies anticipate that this means the ability to move from prototype to certified production faster while maintaining traceability and process stability.

“This partnership represents a major step forward in industrialising metal Additive Manufacturing,” explained Sam O’Leary, CEO of Nikon SLM Solutions. “By integrating Materialise’s software expertise with our proven NXG technology, we’re delivering a platform where advanced control and repeatability meet scalability. It’s a powerful example of co-creation, one that benefits the entire AM ecosystem.”

Both companies also announced that Nikon SLM Solutions has validated the new Materialise NextGen SLM Build Processor (BP), which will soon be available to customers. The NXG SLM BP will provide users with advanced toolpath generation capabilities, handling the extreme data throughput of multi-laser, high-speed Laser Beam Powder Bed Fusion (PBF-LB) Additive Manufacturing machines, enabling optimised scan strategies for higher machine utilisation, and supporting OEM verified parameters as well as advanced customisation.

Using the Materialise Build Processor Software Development Kit (BPSDK), customers can tailor toolpath strategies to specific applications within a secure framework for parameter development and IP protection. Serving as the foundation for deeper integration and machine software connection in the newly announced co-development partnership, the NextGen Build Processor is intended to reflect Nikon SLM’s selection of the BPSDK as its toolkit to develop and embed proprietary toolpath strategies.

The co-developed software solution is expected to introduce a new SLMX file format that supports richer machine data, complete build files, and flexible workflow capability, from automated pre-set builds to fully customised production. Future plans include integration with Materialise’s CO-AM platform for end-to-end workflow automation and SLM.Secure validation for traceable series production.

The new NextGen BP will be showcased at Formnext 2025 at both the Materialise (12.1, C139) and Nikon SLM Solutions (12.0, D119) booths.

nikon-slm-solutions.com

www.materialise.com