The NSERC Network for Holistic Innovation in Additive Manufacturing (HI-AM) will host its 3rd HI-AM Conference at McGill University, Montreal, Canada, on June 25–26, 2020. The organisers are accepting abstract submissions until February 1.
Reported to be the only academic conference in Canada focused exclusively on metal Additive Manufacturing, HI-AM 2020 expects over 100 AM experts and decision-makers from academia, research institutes, industry and government to participatein the 2020 event. With major investment from the Natural Sciences and Engineering Research Council of Canada (NSERC) and Canada Foundation for Innovation (CFI), the HI-AM network investigates fundamental scientific issues associated with metal AM pre-fabrication, fabrication, and post-fabrication processing.
The event provides a platform for the presentation of recent R&D advancements in the field of metal AM under four research themes, including material development, advanced process modelling, process monitoring and control, and innovative AM processes and products. Oral research presentations, poster presentations, and keynote speeches from internationally distinguished industry and academic professionals will take place during the two-day event.
Abstract submissions are invited on the following themes:
- Material Development
- Advanced Process Modelling
- Process Monitoring and Control
- Innovative AM Processes and Products
Further information and submission guidelines are available via the event website.