The AMS Nest at the University of British Columbia, Vancouver, Canada, will host the Natural Sciences and Engineering Research Council of Canada (NSERC) Network’s 2nd Conference for Holistic Innovation in Additive Manufacturing (HI-AM) on June 26-27, 2019. The conference is said to be the only academic conference in Canada focused exclusively on metal Additive Manufacturing.
The NSERC/CFI HI-AM Network was conceived to work on innovative solutions to address the challenges associated with metal AM processes/products and to equip Canada for Industry 4.0. Hosted by a different HI-AM academic partner each year, the conference provides an opportunity for graduate students and other members of the community to network and to demonstrate the value, relevance and importance of the research ongoing in the HI-AM Network.
The 2019 conference will be attended by more than one hundred AM experts and decision makers from academia, research, industry and government, and will include keynote speeches, oral presentations and poster sessions. It is designed to provide a platform for the presentation of recent R&D advancements in the field of metal AM under four research themes:
- Material development
- Advanced process modelling
- Process monitoring and control
- Innovative AM processes and products
This year’s keynote speakers are Professor David Bourell, Temple Foundation Professor, Director of the Laboratory for Freeform Fabrication, University of Texas at Austin, USA; Professor Christoph Leyens, Managing Director Fraunhofer Institute of Materials and Beam Technology, Germany; Professor Milan Brandt, Director Centre for Additive Manufacturing, Advanced Manufacturing Precinct, RMIT University, Australia; Dr Ali Bonakdar, Advanced Manufacturing Technology Lead, Siemens Canada; and Dr Hannes Gostner, Director Research and Development, EOS, Germany.
Conference registration will open on March 1, 2019. Submissions of abstracts for presentation at the conference are currently open and will close on February 1, 2019. Abstracts can be submitted via the conference website.