Formnext Connect, the digital version of the annual Formnext trade show, which has this year moved online due to the coronavirus (COVID-19) pandemic, will run from November 10–12, 2020.
According to event organisers Mesago Messe Frankfurt GmbH, the digital event will host exhibitors from the full global Additive Manufacturing supply chain, and represents the ideal platform for AM users and service providers to connect in 2020.
The digital exhibition will feature a wide range of presentations and showcase the latest innovations from world-leading exhibitors, and will offer intelligent matchmaking and a number of supporting events to give participants insight into specific technologies and recent developments in the AM industry.
Sascha F Wenzler, vice president Formnext at Mesago Messe Frankfurt GmbH, stated, “Formnext Connect offers an important platform for the AM community to efficiently showcase new products, exchange ideas, and discuss projects and business before the end of the year, even in times like these.”
Exhibitors at the digital event include top machine makers from the world of AM, such as 3D Systems, Additive Industries, EOS, Formlabs, GE Additive, HP, Markforged, Materialise, Mitsubishi Heavy Industries, Renishaw, Siemens, SLM Solutions, Stratasys and Trumpf. Some of these companies will reportedly premiere groundbreaking new products at Formnext Connect.
Virtual exhibitors will also include major companies from the wider process chain, such as Autodesk, BASF, H.C. Starck, Heraeus, Höganäs, Oerlikon, Postprocess, and research institutes such as Fraunhofer Institutes IPT, ILT and IAPT, and other innovative companies in the fields of design, materials, hardware, software, post-processing and quality assurance.
Like Formnext, Formnext Connect 2020 will also provide an opportunity for the global startup community to present itself and engage with users and potential investors, and a host of fascinating panel discussions will cover a wide range of topics from the AM world.
A number of sessions will be targeted at specific areas of AM, as well as roundtable discussions which will provide companies with the opportunity to explain technological developments in more detail.
AI-assisted matchmaking software will be used to connect suggested business contacts on the basis of the information and preferences supplied by exhibitors and visitors. “Our focus of connecting participants, who have questions, with expert exhibitors was a deliberate choice. This allows a direct exchange and brings the greatest possible added value for the participants,” explained Wenzler.
Even as a virtual event, Mesago Messe Frankfurt believes Formnext Connect of great importance to the AM world. “Formnext is the leading trade fair for the AM community and thus provides a vital opportunity for us to engage with new and existing customers,” commented Florian Bautz, CEO of exhibitor German RepRap GmbH. “We consider it an absolute must to participate in Formnext Connect as an effective, virtual platform for presenting our solutions and maintaining a dialog with the community.”
Dr Karsten Heuser, VP Additive Manufacturing at Siemens Digital Industries, added, “There is a lot of work ahead of the Additive Manufacturing community as demand increases for robust, productive and industrial Additive Manufacturing production in the ‘New Normal’ manufacturing world.”
Under the slogan ‘Partnering for the next step to industrialise Additive Manufacturing @ Formnext Connect’, Siemens is working intensively on various formats to collaborate with partners and customers, both through discussions on the Formnext Connect platform and in live broadcasts showcasing the latest pioneering achievements for the AM Factory of the Future.
“We are all keeping our schedules free for the three days in November and look forward to seeing everyone again – even if only virtually,” Heuser stated.
More information on the Formnext Connect schedule, and registration details, are available via the event website.