Florida International University adopts WarpSPEE3D for Cold Spray AM
SPEE3D, headquartered in Melbourne, Australia, has announced that the USA’s Florida International University (FIU) has acquired a WarpSPEE3D metal Additive Manufacturing machine. This new machine is expected to become a central feature of large-scale manufacturing at FIU’s Cold Spray and Rapid Deposition (ColRAD) Laboratory, located in the College of Engineering and Computing campus. The acquisition aims to bolster the university’s advanced manufacturing research capabilities and establish FIU as a leader in exploring large-scale composites and metallic alloys using the Cold Spray process.
“At FIU’s ColRAD laboratory at the Department of Mechanical and Materials Engineering, our focus is on using Cold Spray Additive Manufacturing to investigate process-structure relationships, optimise robotic path development for large components, and evaluate material performance against traditional techniques,” stated Dr Tanaji Paul, Assistant Professor at Florida International University. “We look forward to seeing how SPEE3D’s technology will enhance our ongoing research in metal and composite Additive Manufacturing.”
The WarpSPEE3D machine utilises SPEE3D’s proprietary Cold Spray Additive Manufacturing (CSAM) technology, allowing for open experimentation and the rapid production of large, high-quality metal parts in a wide range of materials, including copper, aluminium alloys, and stainless steel. FIU researchers at the ColRAD lab intend to explore the full potential of this technology by focusing on key areas such as correlations between processing parameters and the structural behaviour of additively manufactured metallic parts, robotic path development for complex, large-scale geometries, and benchmarking Cold Spray metallurgical properties against conventionally manufactured components.
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Dr Tyler Dolmetsch, Research Assistant Professor at Florida International University, said, “As one of the few large-scale CSAM technologies available, this will enable us to drive novel findings in metal advanced manufacturing research, and the WarpSPEE3D’s openness and flexibility won’t constrain our ambitions. We are eager to explore the wide possibilities, extending from research, translation of innovation to production, to training and education by virtue of the capabilities of the WarpSPEE3D.”
Steven Camilleri, CTO of SPEE3D, added, “We are thrilled to partner with Florida International University and see WarpSPEE3D play a pivotal role in their ColRAD lab. We believe the technology will empower FIU’s large-scale application research, enabling them to address validation gaps between CSAM material advancements and evolving industry needs.”
The patented WarpSPEE3D machine can manufacture high-density metal parts by depositing feedstock particles at supersonic speeds unrivalled by traditional manufacturing methods. It can create components weighing up to 40kg, with dimensions of approximately Ø 100 cm x 70 cm, and with metallurgical properties superior to casting.
