Asetek’s AI Optimised Cold Plate made in collaboration Fabric8Labs

ApplicationsNews
June 5, 2024

June 5, 2024

The original skived heatsink (left) compared to the complex AI Optimised Cold Plate (Courtesy Asetek)
The original skived heatsink (left) compared to the complex AI Optimised Cold Plate (Courtesy Asetek)

Asetek, a developer of gaming hardware for next-level immersive gaming experiences, headquartered in Aalborg, Denmark, has announced a strategic partnership with Fabric8Labs, a metal Additive Manufacturing company located in San Diego, USA, to advance its liquid cooling technology for the commercial and consumer desktop computer markets.

As seen in Asetek’s Al Optimised Cold Plate, sophisticated AI simulation was used to model the cold plate architecture. This structure utilises highly complex geometries which require an advanced manufacturing method to create. Leveraging Fabric8Labs’ proprietary Electrochemical Additive Manufacturing (ECAM) technology, modelled iteration of this cold plate was able to be produced to the optimised specifications.

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“Partnering with Fabric8Labs allows us to push the boundaries of liquid cooling technology. Their innovative metal 3D printing process enhances our ability to deliver high-performance, reliable, and sustainable solutions,” said John Hamill, COO of Asetek.

The AI Optimised Cold Plate represents a significant leap over previous generations of cooling solutions. By harnessing the power of AI and ECAM technology, Asetek and Fabric8Labs have created a cold plate that optimises fluid dynamics, enhancing thermal performance in ways never seen before (Courtesy Asetek)
The AI Optimised Cold Plate represents a significant leap over previous generations of cooling solutions. By harnessing the power of AI and ECAM technology, Asetek and Fabric8Labs have created a cold plate that optimises fluid dynamics, enhancing thermal performance in ways never seen before (Courtesy Asetek)

The ECAM method allows for the creation of complex, high-resolution structures that are able to improve thermal capabilities via enhanced fluid dynamics. And by eliminating the need for post-processing, ECAM enables high quality and integrity of each cold plate and is highly scalable to support high-volume production demands. Beyond these performance attributes, the AI Optimised Cold Plate production process is also able to emphasise sustainability, as an additively manufactured component.

“We are excited to collaborate with Asetek to bring our proprietary ECAM technology to the desktop market, providing customers with superior performance. This partnership exemplifies our shared dedication to quality and innovation,” said Jeff Herman, CEO and co-founder of Fabric8Labs.

Asetek’s AI Optimised Cold Plate will be featured at the ASUS ROG booth at Computex Taipei, one of the world’s largest computing and technology expos. The event takes place from June 4-7, 2024, at the Taipei Nangang Exhibition Center, Taiwan.

www.fabric8labs.com

www.asetek.com

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ApplicationsNews
June 5, 2024

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