Formnext Asia Shenzhen 2026 set for largest edition next week

EventsNews
August 20, 2026
Formnext Asia Shenzhen 2026 has seen increased domestic and foreign registration numbers compared to last year’s event (Courtesy Guangzhou Guangya Messe Frankfurt)
Formnext Asia Shenzhen 2026 has seen increased domestic and foreign registration numbers compared to last year’s event (Courtesy Guangzhou Guangya Messe Frankfurt)

Formnext Asia Shenzhen will open next week in what organiser Guangzhou Guangya Messe Frankfurt Co Ltd describes as its largest edition to date. Taking place from August 26–28, 2026, the fair will occupy 20,000 m² in Hall 15 of the Shenzhen World Exhibition & Convention Center and feature 330 exhibitors.

Guangzhou Guangya Messe Frankfurt reports that visitor pre-registration has increased compared with the same point last year, with international visitor pre-registrations up by more than 50%. The fringe programme will feature twelve forums and other activities, including five new additions covering Additive Manufacturing applications across Asia and China’s Greater Bay Area. Topics will include AM applications for humanoid robotics and AI data centre cooling, additively manufactured footwear and Shenzhen’s desktop AM ecosystem.

The show floor will bring together materials, printers and hardware, software, inspection tools and post-processing equipment for Additive Manufacturing. International exhibitors from Germany, Japan, Singapore and the USA will take part, alongside an International Pavilion bringing together companies from France, Germany, South Korea and Spain. The exhibition will also include a dedicated pavilion for exhibitors from Jiangsu, one of China’s major manufacturing provinces, and a Start-up Area for emerging AM companies.

New forums cover emerging AM applications

Five new forums in the Formnext Asia Shenzhen fringe programme will examine developing AM applications across Asia. These will cover AI and data centres, robotics and embodied intelligence, and commercial aviation and aerospace. Further subjects will include AM in mold making, Binder Jetting for 3C electronics and smartphones, and laser-based Additive Manufacturing.

Two additions are Formnext Asia Shenzhen Maker Day, co-organised with TroubleMaker, a Shenzhen maker and hardware development community, and the Global Channel Partner & Dealer Business Matching Meeting. Maker Day will include open-mic sessions, curated exhibitor tours and off-site factory visits. The business matching meeting will bring Chinese AM companies together with international distributors, dealers and channel partners with the aim of developing new partnerships.

Formnext Asia Shenzhen and PCIM Asia Shenzhen run concurrently

Running alongside Formnext Asia Shenzhen will be another Messe Frankfurt fair, PCIM Asia Shenzhen, an exhibition and conference for power electronics in Asia covering intelligent motion, renewable energy and energy management.

A single visitor registration will provide access to both fairs, allowing participants to explore technologies and applications across Additive Manufacturing and power electronics.

Those interested in attending can register here.

www.formnext-shenzhen.com

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EventsNews
August 20, 2026

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