HP announces material innovations and global collaborations at Formnext
At Formnext 2025, HP Additive Manufacturing Solutions (HP AM) unveiled a series of developments and collaborations aimed at accelerating the adoption of Additive Manufacturing across various industries. The company is showcasing these and offering live demonstrations at its booth in Hall 12.1, D41.
Materials
Among the announcements are the introduction of multiple materials to its Metal Jet Binder Jetting (BJT) Additive Manufacturing portfolio, including the qualification of OptiPowder Ni718 and OptiPowder M247LC.
Continuum Powders, based in Houston, Texas, USA, and INDO-MIM, headquartered in Bengaluru, India, have qualified OptiPowder Ni718 for use on the HP Metal Jet S100, reportedly achieving sintered components with over 98% density, consistent hardness (74-79 HR15N), and precise carbon control.
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Building on this qualification, HP AM Solutions is collaborating with Continuum and Tecnalia, based in Donostia-San Sebastián, Spain, who are working to advance the development of OptiPowder M247LC. This material is a low-carbon, nickel-based superalloy designed for high-temperature applications where both strength and corrosion resistance are essential, making it well-suited to sectors like aerospace and energy. Once qualified, the framework will be extended to include additional high-performance nickel specialty alloys in an effort to further advance Binder Jetting Additive Manufacturing technology as a scalable, production-ready solution.
HP AM is also collaborating with the Additive Manufacturing Team at GKN Powder Metallurgy to expand access to copper applications, enabling production of advanced components for cloud computing, electrification, and thermal management. Using HP Metal Jet technology and GKN’s material and production capabilities in the US and Europe, the collaboration is expected to drive measurable efficiency gains and operational savings at end user data centres, projected in the millions over the next five years.
Simplified supply chains
As part of the ongoing mission to accelerate the adoption of Additive Manufacturing across industries, HP AM and Würth Additive Group, Greenwood, Indiana, USA, have partnered to integrate HP’s scalable, quality-assured manufacturing with Würth’s Digital Inventory Services (DIS) and global logistics network.
This enables manufacturers to shift from physical stock to on-demand spare parts management, anywhere in the world. By embedding digital inventory directly into Würth’s logistics ecosystem, users are shown real-time availability and consistent part validation.
This collaboration marks the first official implementation of the 3MF Secure Content extension, enabling secure Additive Manufacturing workflows directly to HP machines. Through this integration, the companies are working to reduce inventory costs, accelerate delivery, and build more resilient, sustainable supply chains worldwide.
Formnext 2025
HP Additive Manufacturing Solutions will offer live demonstrations as well as sample materials and applications at Formnext 2025 from Hall 12.1, D41.
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