Triditive and Foxconn partner to develop Binder Jetting machine

April 25, 2022

Foxconn is a leading electronics manufacturing company headquartered in New Taipei City, Taiwan (Courtesy Foxconn)
Foxconn is a leading electronics manufacturing company headquartered in New Taipei City, Taiwan (Courtesy Foxconn)

Foxconn, the trading name of Hon Hai Technology Group, a leading electronics manufacturing company headquartered in New Taipei City, Taiwan, and Triditive, a producer of automated Additive Manufacturing technology based in Asturias, Spain, have partnered to develop a new Binder Jetting (BJT) AM machine.

Foxconn is one of the largest companies in the technology sector and produces devices for companies such as Apple, Sony and Intel. The company has extensive Metal Injection Moulding (MIM) operations and has been utilising Additive Manufacturing for a number of years.

Both companies are currently developing their first prototype Binder Jetting machine, along with the materials required for subsequent commercialisation.

For the development of the binders, Triditive has collaborated with Tecnalia, the research and technological development centre of the Basque Country (País Vasco), Spain. It has also worked with Fraunhofer Technology Center High Performance Materials (Fraunhofer THM) for the selection of metal powders.

The key advantage of the innovative technology that Foxconn and Triditive are developing is reported to be the scalability of production and the reduction of costs in the manufacture of complex metal parts for end-use applications.

In the latest issue of Metal AM magazine

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