SPEE3D installs further metal Additive Manufacturing systems
One of SPEE3D’s metal AM systems was on show at the Australian National Manufacturing Week exhibition (Courtesy SPEE3D)
SPEE3D, headquartered in Melbourne, Australia, has announced further installations of its industrial metal Additive Manufacturing machines. Over a three week period, the company installed one of its machines at Swinburne University, Melbourne, one at the University of Delaware, USA, and a WarpSPEE3D system at FIT AG in Germany, reported to be the second of two SPEE3D machines now in use at the company. SPEE3D also displayed its Additive Manufacturing systems in the USA at Rapid + TCT, Detroit, and another was featured at the Australian National Manufacturing Week in Melbourne, the country’s largest manufacturing show.
Once delivered, SPEE3D systems are reported to be relatively quick to commission. “Typically, 3D printers of this size and complexity require up to two weeks to install and set up, however SPEE3D printers can be installed in a matter of hours. We’ve had machines delivered at 9am and can be printing parts by lunch time,” stated Byron Kennedy, SPEE3D Co-founder and CEO.
SPEE3D provides manufacturers with the world’s first metal AM system to use what it calls supersonic 3D deposition (SP3D), a patented technology said to enable significantly faster, cost-effective and more scalable production than traditional metal printing techniques allow.
“The LightSPEE3D printer we had installed is running great,” stated Larry Holmes, Assistant Director of the Digital Design and Additive Manufacturing, Centre for Composite Materials, at the University of Delaware. “It’s also easy to operate, SPEE3D trained one of our staff who was then able to train other operators. The team are now using the machine every day,” .
SPEE3D also recently launched its inaugural ‘Supersonic 3D Printing Design Challenge’, a competition aimed at Additive Manufacturing communities globally to present the best application design using SPEE3D’s LightSPEE3D and large format WarpSPEE3D systems. The deadline for entries is July 31, 2019, and further details are available via the company’s website.
