Dyndrite named a Technology Pioneer by World Economic Forum

June 16, 2021

Dyndrite has been selected as the World Economic Forum’s ‘Technology Pioneers’ (Courtesy Dyndrite)

Software developer Dyndrite, headquartered in Seattle, Washington, USA, has been selected as one the World Economic Forum’s ‘Technology Pioneers’. This title is awarded to early-to-growth-stage companies from around the world that are involved in the use of new technologies and innovation that are poised to have a significant impact on business and society.

With this selection as Technology Pioneer, Harshil Goel, Dyndrite’s CEO and founder, will be invited to participate in World Economic Forum activities, events and discussions throughout the year. Dyndrite will also contribute to forum initiatives over the next two years, working with global leaders to help address key industry and societal issues.

“Dyndrite and its fellow pioneers are developing technologies that can help society solve some of its most pressing issues,” stated Susan Nesbitt, Head of the Global Innovators Community, World Economic Forum. “We look forward to their contribution to the World Economic Forum in its commitment to improving the state of the world.”

Dyndrite made it to the selection for its contributions in the field of advanced manufacturing, wherein it offers an accelerated computation engine that brings automation and scalable compute to Additive Manufacturing solutions.

“We are both humbled and honoured to be acknowledged as a pioneer by the World Economic Forum,” commented Goel. “Additive Manufacturing has the potential to transform humanity but requires a new approach in software technology. Dyndrite is revolutionising the way 3D geometry is created, transformed and transmitted on a computer, and by doing so we empower Additive Manufacturing to deliver serial production, at scale.”

Technology Pioneers have been selected based on the community’s selection criteria, which includes innovation, impact and leadership as well as the company’s relevance with the World Economic Forum’s Platforms.


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As well as an extensive AM industry news section, this 204-page issue includes articles and reports on:

  • Optimised thermal management in semiconductor fabrication using AI-enabled generative design and Additive Manufacturing
  • Forging a process for mass customisation via metal Additive Manufacturing
  • Bringing it all together: How Materialise is integrating manufacturing and software expertise to shape AM’s future
  • Pedal to the metal at the Digital Manufacturing Centre: Redefining what’s possible for AM in hypercars and beyond
  • The future is Additive Manufacturing – if we take a more holistic view of the design opportunities
  • Building a case for radical collaboration plus quality standards: The pathway to growing the AM industry
  • Distributed manufacturing: Old concept, new relevance, new technology?
  • Design for Additive Manufacturing: A workflow for a metal AM heat exchanger using nTopology (BJT)
  • Taking the holistic view:
    Defining the state-of-the-art in the evolving PBF-LB machine marketplace
  • > More information

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