Velo3D, Campbell, California, USA, and semiconductor specialist Lam Research Corporation, Fremont, California, USA, will collaborate on novel materials and designs for metal Additive Manufacturing of applications in the semiconductor industry, as part of a joint development agreement.
Lam plans to significantly increase the volume of parts produced by AM in the semiconductor industry over the next five years, and Velo3D states that under the joint development agreement it will develop new metal alloys for processing on its Sapphire® metal AM machine, which uses Laser Beam Powder Bed Fusion (PBF-LB), that are said to be critical to Lam designs and technologies.
Lam Capital, a venture group of Lam Research Corporation, will also invest an undisclosed amount in Velo3D. Velo3D recently closed a $40 million round of funding, bringing total funding for the company to $150 million. This new investment is said to enable the company to expand its technology capabilities and reach profitability by mid-2022.
“Lam Research is leveraging Additive Manufacturing as a driver of the innovation that enables our customers to build smaller, faster, more powerful and power-efficient electronic devices for everyday use,” commented Kevin Jennings, senior vice president of Global Operations at Lam Research. “This joint development arrangement aligns well with Lam’s mission to continuously seek new technologies that push the limits of product design and manufacturing. We are excited to lead the semiconductor industry in delivering value to our customers from AM.”
Benny Buller, CEO and founder of Velo3D, stated, “Semiconductor manufacturing is one of the best examples of high-volume production and Lam requires the highest levels of repeatability and consistency to achieve precision control at atomic scale. Velo3D is well-positioned to provide confidence in metal 3D printing due to our calibration, metrology, and digital traceability capabilities.”
“This relationship aims to accelerate Lam’s journey of continuous innovation toward producing equipment that creates cutting-edge microprocessors, memory devices, and numerous related product types,” Buller concluded.