SPEE3D brings its Cold Spray Additive Manufacturing to Japan with defence partnership
September 13, 2023
SPEE3D, headquartered in Melbourne, Australia, has partnered with the Japan Ground Self-Defence Force (JGSDF) to introduce its Cold Spray Additive Manufacturing (CSAM) technology to Japan. This contract with the Japan Ministry of Defence is said to be a significant milestone as SPEE3D continues to expand into the Asia-Pacific region.
The Japanese Self Defence Force will receive a WarpSPEE3D and an XSPEE3D. The WarpSPEE3D is SPEE3D’s first large-format metal Additive Manufacturing machine, capable of producing large metal parts quickly. The company’s latest model, XSPEE3D, provides a deployable metal Additive Manufacturing capability with SPEE3D’s patented Cold Spray AM technology and auxiliary equipment integrated within a single containerised shipping container unit. This enables industries operating remotely, such as defence, to build metal parts on-site and on-demand.
“We are grateful for the opportunity to expand our presence into Japan and the APAC region. It is indeed an honour to collaborate with the Japanese military,” shared Byron Kennedy, CEO, SPEE3D. “Our aim is to train and prepare their forces to use the XSPEE3D printer in the field to address their most urgent supply chain issues through quickly manufactured on-demand parts.”
The SPEE3D technology has been utilised by various defence forces worldwide, including field trials by the Australian, US, and UK militaries. With this technology, Japan’s self-defence forces now possess the ability to manufacture critical replacement parts on demand in minutes or hours. This can be done using a range of materials, including aluminium 6061, aluminium bronze, copper, and stainless steel.
As part of the partnership, SPEE3D will provide the JGSDF with comprehensive training, support, and maintenance for both WarpSPEE3D and XSPEE3D. This includes field exercise programmes with the XSPEE3D, ensuring that Japan’s forces are well-equipped to fully utilise the potential of this technology in the field and on base.
