Scholarships available to attend MS&T18 AM modeling symposium

August 29, 2018

The MS&T18 symposium ‘Additive Manufacturing: Modeling and Simulation of AM Materials, Processes, and Mechanics’, takes place from October 14-18, 2018, in Columbus, Ohio, USA. The event has received funding from the National Science Foundation (NSF/CMMI Award #1836555) in order to support selected students, postdoctoral researchers and young investigators studying at US institutions to attend the conference.

The scholarships includes $750 to cover travel, lodging and other related expenses to attend MS&T18 AM symposium and an MS&T18 conference registration waiver (>$110).

Full information on the conditions and requirements is available at​. Note that the deadline for completed applications is September 8, 2018. Notice of award will be sent out by September 11.

Full details of the symposium are available at

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