Scholarships available to attend MS&T18 AM modeling symposium
August 29, 2018
The MS&T18 symposium ‘Additive Manufacturing: Modeling and Simulation of AM Materials, Processes, and Mechanics’, takes place from October 14-18, 2018, in Columbus, Ohio, USA. The event has received funding from the National Science Foundation (NSF/CMMI Award #1836555) in order to support selected students, postdoctoral researchers and young investigators studying at US institutions to attend the conference.
The scholarships includes $750 to cover travel, lodging and other related expenses to attend MS&T18 AM symposium and an MS&T18 conference registration waiver (>$110).
Full information on the conditions and requirements is available at http://bit.ly/MST18AM. Note that the deadline for completed applications is September 8, 2018. Notice of award will be sent out by September 11.
Full details of the symposium are available at http://bit.ly/2PMuCE9
