Scholarships available to attend MS&T18 AM modeling symposium

August 29, 2018

August 29, 2018

The MS&T18 symposium ‘Additive Manufacturing: Modeling and Simulation of AM Materials, Processes, and Mechanics’, takes place from October 14-18, 2018, in Columbus, Ohio, USA. The event has received funding from the National Science Foundation (NSF/CMMI Award #1836555) in order to support selected students, postdoctoral researchers and young investigators studying at US institutions to attend the conference.

The scholarships includes $750 to cover travel, lodging and other related expenses to attend MS&T18 AM symposium and an MS&T18 conference registration waiver (>$110).

Full information on the conditions and requirements is available at​. Note that the deadline for completed applications is September 8, 2018. Notice of award will be sent out by September 11.

Full details of the symposium are available at

August 29, 2018

In the latest issue of Metal AM magazine

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Extensive AM industry news coverage, as well as the following exclusive deep-dive articles:

  • Metal powders in Additive Manufacturing: An exploration of sustainable production, usage and recycling
  • Inside Wayland Additive: How innovation in electron beam PBF is opening new markets for AM
  • An end-to-end production case study: Leveraging data-driven machine learning and autonomous process control in AM
  • Consolidation, competition, and the cost of certification: Insight from New York’s AM Strategies 2024
  • Scandium’s impact on the Additive Manufacturing of aluminium alloys
  • AM for medical implants: An analysis of the impact of powder reuse in Powder Bed Fusion

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