Scholarships available to attend MS&T18 AM modeling symposium

August 29, 2018

August 29, 2018

The MS&T18 symposium ‘Additive Manufacturing: Modeling and Simulation of AM Materials, Processes, and Mechanics’, takes place from October 14-18, 2018, in Columbus, Ohio, USA. The event has received funding from the National Science Foundation (NSF/CMMI Award #1836555) in order to support selected students, postdoctoral researchers and young investigators studying at US institutions to attend the conference.

The scholarships includes $750 to cover travel, lodging and other related expenses to attend MS&T18 AM symposium and an MS&T18 conference registration waiver (>$110).

Full information on the conditions and requirements is available at​. Note that the deadline for completed applications is September 8, 2018. Notice of award will be sent out by September 11.

Full details of the symposium are available at

Spring 2023 issue of Metal AM magazine
August 29, 2018

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  • Separation anxiety: Lessons learned at NASA from a developmental rocket engine failure
  • What is 'good' metal AM? Exploring the industry's value metrics for production
  • An inside perspective on China’s thriving metal Additive Manufacturing industry
  • Additive Manufacturing for jewellery and watchmaking: Exploring the potential of sinter-based technologies
  • Metal Additive Manufacturing for digital dentistry: An introduction for dental professionals
  • Case study: The development of a multi-material heat sink by Additive Manufacturing using Aerosint technology

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