PostProcess celebrates fifty patents across software, hardware and chemistry solutions
July 3, 2025

PostProcess Technologies Inc, based in Buffalo, New York, USA, has been granted its fiftieth patent, achieved across software, hardware, and chemistry solutions for Additive Manufacturing post-processing.
“Our 50th granted patent is more than just a number, it is a testament to the relentless drive of our team to continually innovate,” said Jeff Mize, CEO of PostProcess Technologies. “The ingenuity of our team, combined with invaluable input from our 500+ customers, continues to fuel game-changing solutions to the market. We’ve believed from the start in building full-stack offerings that integrate software, hardware, and chemistry, that are protected and differentiated, resulting in intelligent, reliable solutions for our customers.”
TRUSTED CONTENT. TARGETED AUDIENCE
Advertise with Metal AM and access a global base of 50,000+ AM professionals
Contact us |
According to the company, a critical factor in building its IP portfolio has been its in-house legal strategy.
“PostProcess has taken an intentional, strategic approach to IP from day one,” said Frank Kozak, General Counsel at PostProcess. “These patent grants are an affirmation of advancements in the field of post-processing and a validation of our approach to innovation. We’ve been able to move quickly, maintain quality, and ensure that every patent aligns with our long-term vision to automate and scale post-printing.”
PostProcess has built a portfolio aimed at safeguarding its inventions across the entire solution stack. These patents protect proprietary hardware and sophisticated software as well as the chemistry that works together to create a complete, automated post-processing solution.
Among PostProcess’ product lines are the BASE and DEMI series for automated support and resin removal. The BASE delivers high-throughput Fused Deposition Modelling (FDM) Additive Manufacturing support removal with patented Volumetric Velocity Dispersion (VVD) technology, ideal for large-format AM machines and high-volume production environments.
The DEMI series features the patented Submersed Vortex Cavitation (SVC) technology and intelligent software to precisely manage agitation, temperature, and time, achieving consistent, hands-free resin and support removal across a wide range of part geometries and materials.