Nippon Chuzo adds eight-laser BLT-S450 to expand semiconductor industry capacity
Nippon Chuzo Co, Ltd, headquartered in Kawasaki City, Kanagawa Prefecture, Japan, has ordered an eight-laser BLT-S450 Laser Beam Powder Bed Fusion (PBF-LB) Additive Manufacturing machine from China’s Xi’an Bright Laser Technologies Co., Ltd (BLT).
In a statement from the company, Nippon Chuzo confirmed the new BLT-S450 will be supplied via BLT’s official Japanese distributor, Orix Rentec Corporation, with delivery expected in April 2026.
The BLT-S450 has a build volume of 450 × 450 × 500 mm, and will be used to manufacture silicon wafers destined for the semiconductor industry. It has eight 500 W lasers and can process a range of materials, including titanium alloys, aluminium alloys, high-temperature alloys, stainless steel, high-strength steel and more.
“We are also working on manufacturing hybrid products that combine conventional cast parts with metal 3D-printed elements,” stated Yoshihiro Satake, President & CEO of Nippon Chuzo. “Looking ahead, we will continue exploring the introduction of even larger metal 3D printers. Through these efforts, we aim to accelerate responses to the labour shortage of skilled workers caused by a declining birthrate and ageing population, as well as the ongoing digitalisation of society.”
