3DEO secures investment from Seiko Epson and Development Bank of Japan

Companies & MarketsNews
January 19, 2024

January 19, 2024

3DEO received a 2023 MPIF Award of Distinction for this fastener assembly used to attach the inter-car baffles to retaining frames on bullet trains (Courtesy MPIF)
3DEO received a 2023 MPIF Award of Distinction for this fastener assembly used to attach the inter-car baffles to retaining frames on bullet trains (Courtesy MPIF)

3DEO, headquartered in Los Angeles, California, USA, has announced a significant investment from the Development Bank of Japan Inc. (DBJ) and Seiko Epson Corporation (EPSON), reported to total around one billion yen ($6.8 million).

According to Nikkei Asia, Epson and DBJ participated in a funding round held by 3DEO that involved existing investors. While the full details have not been disclosed, the investment made by the two Japanese companies was believed to account for a roughly 5% stake, it was reported.

This latest investment is expected to boost 3DEO’s growth strategies in North America and Japan, expanding opportunities for partnership in the semiconductor, aerospace, medical devices and equipment, and industrial sectors.

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“The collaboration with DBJ and EPSON is a powerful endorsement of our mission to empower product and engineering teams across the globe,” stated Matthew Petros, CEO and co-founder of 3DEO. “This investment is not just capital; it’s a commitment to a shared vision of challenging what’s possible through the combination of additive design principles and differentiated capabilities.”

In Japan, there is a strong belief in conventional metalworking based on precision casting, which has supported the growth of the machining and assembly industry, as well as the optimisation of the supply chain in terms of quality and cost. However, while there is a movement toward research and development of AM technologies and DfAM, the adoption rate at production sites faces significant barriers. This collaboration is poised to address these challenges, contributing to the advancement of AM technologies within Japan’s established manufacturing landscape.

DBJ and EPSON’s investment, secured after careful review by the Committee on Foreign Investment in the United States (CFIUS), will enable 3DEO to leverage the Japanese manufacturing industry’s strengths while fostering technological advancements in both regions.

“By integrating 3DEO’s AM capabilities with the meticulous engineering tradition of Japan, we aim to unlock new levels of productivity and expand the manufacturing possibilities in one of the world’s leading economies,” added Payman Torabi, CTO and co-founder of 3DEO. “This investment is a testament to the trust and potential seen in 3DEO’s innovative approach. We are excited to collaborate with DBJ and Epson, leveraging their expertise and market reach to enhance and refine the landscape of Additive Manufacturing.”

Founded in 2016, 3DEO is an Additive Manufacturing service bureau using its in-house patented process it calls Intelligent Layering. The technology is a fusion of Binder Jetting (BJT) and CNC machining that 3DEO claims is faster, cheaper and capable of higher resolution than BJT alone. 3DEO’s unique AM process and its advanced Design for Additive Manufacturing (DfAM), is underpinned by a differentiated portfolio of eighteen patents.

corporate.epson

www.dbj.jp/en

www.3DEO.co

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Companies & MarketsNews
January 19, 2024

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