HP announces upgrades and collaborations at Formnext 2024

November 19, 2024

HP announced new configurations for its Metal Jet S100 Additive Manufacturing platform (Courtesy HP)
HP announced new configurations for its Metal Jet S100 Additive Manufacturing platform (Courtesy HP)

At Formnext 2024, HP has introduced numerous additions to its Additive Manufacturing solutions portfolio and partnerships aimed at reducing cost, scaling production and accelerating the adoption of metal AM.

HP S100 platform upgrades

The company announced new configurations for its HP Metal Jet S100 platform, all intended to enhance quality, repeatability, speed, and reliability across a broader range of production needs. These new configurations are expected to enable research centres, OEMs, national laboratories, and startups to explore metal Binder Jetting at reduced adoption costs. The new configurations are expected to be available in 2025.

In parallel, HP is collaborating with Volkmann and Sinterzone to develop respective configurations for the HP S100 platform.

Those interested in learning more about the HP S100 platform can hear Alex Tartas, Global Head of Sales & GTM Metals 3D Printing HP, talk on the Technology Stage about expanding use cases of the machine. The talk will be held on Wednesday (November 20) at 14.15 local time.

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Collaborations

HP has also been taking part in collaborations with ArcelorMittal and Eaton. With ArcelorMittal, HP has combined its own metal Additive Manufacturing experience with ArcelorMittal’s sustainable steel in an effort to reduce production costs, expand material options, and drive broader adoption of additively manufactured steel in key industries like automotive.

Through its collaboration with Eaton, HP has been working to support testing and validation of advancements in it its Metal Jet Additive Manufacturing solution. Thus far, the companies have worked on nitrogen-enhanced sintering, which is said to improve the mechanical properties of 316L parts, and the S100 Powder Processing Solution, said to reduce cost and improve yield during Binder Jetting. Together, the companies will evaluate the technology’s potential for high-performance applications, ensuring it meets the industry’s demands.

Eric Johnson, Senior Manager Additive Manufacturing at Eaton Research Labs, added, “Partnering with HP on this programme has been an exciting opportunity to advance the manufacturing readiness of this technology and develop a cost-effective process that meets the requirements for our most demanding applications.”

HP Metal Jet Adoption Cente

In collaboration with AMES, located in Barcelona, Spain, HP is launching a HP Metal Jet Adoption Center. This state-of-the-art facility will combine HP’s Additive Manufacturing technology with AMES’ metallurgical expertise to facilitate a more efficient transition from prototyping to full-scale metal production. The centre hopes to offer a range of services, application development, and process optimisation to support European customers in quickly advancing production goals.

Leading Minds Consortium

The Leading Minds Consortium brings together industry leaders like 3D Systems, Ansys, EOS, HP, Materialise, Nikon, SLM, Renishaw, Stratasys, and Trumpf, with the goal of overcoming barriers such as cost, expertise, and system integration, making large-scale industrial AM more accessible.

Visit HP at Formnext in Hall 12.1, Booth D41.

www.hp.com

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  • Additive Manufacturing for Semiconductor Capital Equipment: Unlocking critical supply chains
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  • Inspect Additive Manufacturing, stop monitoring: Phase3D’s unit-based, in-process inspection solution for powder bed AM

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