EOS expands metal powder range for Oil & Gas and semiconductor industries
March 6, 2025
EOS GmbH, headquartered in Krailling, Germany, has announced the availability of two more metal powders for use in its Laser Beam Powder Bed Fusion (PBF-LB) Additive Manufacturing machines. The company has added EOS NickelAlloy IN718 API, suited to applications in the Oil & Gas sector, and EOS Nickel NiCP, ideal for use in semiconductor industries.
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EOS NickelAlloy IN718 API
This nickel-based material is said to offer high-impact toughness at low temperatures and good corrosion resistance for high-stress oil and gas applications; it has a tensile strength of 878 MPa and 27% elongation when combined with a specific heat treatment. Meeting the requirements for API 6ACRA standardisation, manufacturers can use IN718 API to additively manufacture components for downhole, injection and fixture, and fastener applications, among others.
A leading inflow control technology organisation provided an early test case for IN718 API, producing a flow module component meeting API standardisation and high-strength performance while being subjected to the corrosive environment of oil and gas equipment (see above image).
“Additive Manufacturing has previously been out of reach as a solution for demanding downhole applications due to the stringent requirements of the oil and gas industry,” the customer stated. “With the development of EOS NickelAlloy 718 API, we are now able to evaluate industrial 3D printing’s business case for our manufacturing needs, while ensuring all facets of part performance remain unchanged.”
EOS Nickel NiCP
This material provides a tensile strength of 400 MPa and 49% elongation, making it well-suited for applications like gas injectors and corrosion-resistant components within semiconductor capital equipment.
Traditionally manufactured applications in the semiconductor equipment industry often include electroless nickel plating to increase corrosion resistance in chemically harsh conditions. Parts manufactured entirely from NiCP are said to require no plating, thus extending component life.
“By additively manufacturing these parts, manufacturers can maximise machine uptime and availability, which in turn increases overall throughput of the wafer fabrication process and benefits the end user’s revenue,” stated Sophia Heyl, EOS Product Specialist. “Eliminating the electroplating process that generates hazardous waste offers a cleaner, more sustainable manufacturing process for the future.”
Dr. Ankit Saharan, EOS Director of Metals Technology, added, “EOS Nickel NiCP has already been successfully deployed in production settings, demonstrating its reliability and performance. By making it more broadly available, we continue to strengthen our engagement with the semiconductor industry and our dedication to advancing their applications through innovative materials and processes. We look forward to working with our partners to push the boundaries of what’s possible with NiCP in Additive Manufacturing.”
