New conference to focus on Additive Manufacturing in products and applications

News
November 25, 2016

November 25, 2016

ETH Zurich, a science, technology, engineering and mathematics university in the city of Zürich, Switzerland, along with inspire AG, a technology transfer organisation, will host a new conference dedicated to the industrial applications of Additive Manufacturing. The Conference on Additive Manufacturing in Products and Applications, AMPA, will be held September 13 – 15, 2017, at ETH Zurich, Switzerland.

The aim of the conference is to exchange ideas and knowledge among researchers and professionals from engineering, design and management on how to support real-world value chains by developing additively manufactured serial products.

The AMPA will cover all topics necessary to develop, manufacture and launch a successful AM product into the market.

Design Tools and Methods

  • Design for AM
  • Simulation
  • Design Automation
  • Prototyping and Testing

Manufacturing Process Chains

  • Integration in Manufacturing Process Chains
  • Product Qualification
  • Quality Assurance
  • Health & Safety

Business Cases for AM applications

  • Use-Cases of AM-Products
  • Identification of AM-Opportunities

Teaching and Training

Unique Customer Benefits

www.ampa.ethz.ch

News
November 25, 2016

In the latest issue of Metal AM magazine

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Extensive AM industry news coverage, as well as the following exclusive deep-dive articles:

  • Metal powders in Additive Manufacturing: An exploration of sustainable production, usage and recycling
  • Inside Wayland Additive: How innovation in electron beam PBF is opening new markets for AM
  • An end-to-end production case study: Leveraging data-driven machine learning and autonomous process control in AM
  • Consolidation, competition, and the cost of certification: Insight from New York’s AM Strategies 2024
  • Scandium’s impact on the Additive Manufacturing of aluminium alloys
  • AM for medical implants: An analysis of the impact of powder reuse in Powder Bed Fusion

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  • Reviews of key technical presentations from the international conference circuit
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