Equispheres and Taiyo Nippon Sanso Corporation enter strategic partnership
Equispheres, Inc, Ottawa, Ontario, Canada, has signed a strategic partnership agreement with Taiyo Nippon Sanso Corporation (TNSC), Tokyo, Japan, which will see the companies collaborate to improve the economics and quality of additively manufactured parts in the Japanese market.
Equispheres produces specialised powder with unique attributes for Additive Manufacturing that are said to be capable of achieving three times faster build rates than legacy aluminium powders. TNSC is a provider of gases and related welding solutions at its AM Innovation Centre.
“Their expertise in metal Additive Manufacturing, company resources and deep connections to the Japanese market will accelerate the adoption of our material in the marketplace, with an emphasis on the automotive industry,” stated Kevin Nicholds, CEO of Equispheres.
Tadaharu Watanabe, Senior General Manager of Innovation Business Division (TNSC) commented, “We are very impressed with the quality of the Equispheres powder and view it as best-in-class for its ability to print high quality parts at a reduced cost. TNSC plans to offer the powder and our deep knowledge of its application along with our other integrated Additive Manufacturing services to better serve the AM industry in Japan.”
The relationship between the companies was established after a year-long analysis of Equispheres powder by TNSC. The companies plan to collaborate on R&D projects to develop enhanced applications for the powder and provide further value to the industry. Material sales and engineering support for North America and Europe will continue to be handled directly by Equispheres.
“TNSC has a history of seeking out best-in-class technology, and we’re very proud that they have added us to their Additive Manufacturing portfolio. TNSC has the skills and the knowledge to represent and support our aluminium powders, and the company is already deeply integrated with manufacturers and the automotive sector in Japan,” Nicholds concluded.
