Dou Yee Technologies advances metal Binder Jetting programme with HP and NAMIC
Dou Yee Technologies Pte Ltd (DYT), headquartered in Singapore, has reported that it is developing its metal Binder Jetting (BJT) capabilities, building on its range of metal Additive Manufacturing services and extending its expertise in Powder Injection Moulding (PIM) to sinter-based metal AM.
Established in 1996, the company manufactures Metal Injection Moulding (MIM) and Ceramic Injection Moulding (CIM) components for sectors including medical, automotive, consumer, industrial and semiconductor manufacturing. It also offers metal Laser Beam Powder Bed Fusion (PBF-LB) and Fused Filament Fabrication, as well as polymer AM services.
The BJT programme is being developed in collaboration with A*STAR’s Additive Innovation Centre (AIC), the National Additive Manufacturing Innovation Cluster (NAMIC) and HP. The work follows a Memorandum of Understanding signed by DYT, NAMIC and HP in October 2025 to establish a ‘development-to-production’ workflow for metal Binder Jetting applications.
The current programme uses HP Metal Jet technology and initially focuses on 316L and 17-4PH stainless steels. According to DYT, both materials have been qualified within the programme, while copper is under evaluation. Nickel superalloys and WC-Co are identified as materials for future development.
DYT states that the wider objective of the programme is to establish a repeatable route from application development and material qualification through to production.
