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3D Systems

The Additive Manufacturing of record-breaking pure copper heatsinks for high-performance computing applications

Article3D SystemsDesign for AMProcessingSoftware
November 21, 2024

As high-performance computing (HPC) and Artificial Intelligence (AI) applications drive demand for more powerful processors, thermal management has become a critical challenge. This article explores the development of a generatively-designed and additively manufactured liquid nitrogen (LN2) heatsink, created by 3D Systems and Diabatix in collaboration with SkatterBencher and ElmorLabs, that achieves groundbreaking cooling performance. Thanks to Additive Manufacturing, the resulting pure copper heatsink promises to open up new markets for the technology in this rapidly growing market. ... Read more »

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  • Back to the future: A decade of Additive Manufacturing innovation and growth at Materials Solutions
  • Win or lose: A CEO’s reflections on Artificial Intelligence and Additive Manufacturing
  • AMS 2025 New York: A reality check for the Additive Manufacturing industry
  • Optimising powder removal in PBF-LB Additive Manufacturing: A Digital Twin approach
  • ValCUN’s MMD: A robust, wire-based aluminium AM technology for defence and industrial applications
  • Enhancing quality and reliability in metal Additive Manufacturing: The role of laser calibration

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