HI-AM Conference 2020 [ONLINE]

January 9, 2020

June 25, 2020

Dates
June 25, 2020 to June 26, 2020

Event website
nserc-hi-am.ca/2020/


 

The HI-AM Conference is the only academic conference in Canada focused exclusively on metal additive manufacturing. With over 100 additive manufacturing experts and decision-makers from academia, research institutes, industry and government participating, HI-AM 2020 is an event not to be missed.

This conference facilitates the dissemination of AM research results to the scientific community and among HI-AM Network members. Hosted by one of the HI-AM academic partners each year, the conference provides a great opportunity to foster cross-theme knowledge exchange and demonstrate the value, relevance, and importance of the research on-going in the HI-AM Network.

The focus of HI-AM Conference is to provide a platform for the presentation of recent R&D advancements in the field of metal additive manufacturing under 4 research themes:

  1. material development
  2. advanced process modeling
  3. process monitoring and control
  4. innovative AM processes/products

The main features of HI-AM Conference will include oral research presentations, poster presentations, and keynote speeches from internationally distinguished industry and academic professionals.

January 9, 2020

In the latest issue of Metal AM magazine

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Extensive AM industry news coverage, as well as the following exclusive deep-dive articles:

  • Metal powders in Additive Manufacturing: An exploration of sustainable production, usage and recycling
  • Inside Wayland Additive: How innovation in electron beam PBF is opening new markets for AM
  • An end-to-end production case study: Leveraging data-driven machine learning and autonomous process control in AM
  • Consolidation, competition, and the cost of certification: Insight from New York’s AM Strategies 2024
  • Scandium’s impact on the Additive Manufacturing of aluminium alloys
  • AM for medical implants: An analysis of the impact of powder reuse in Powder Bed Fusion

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  • Reviews of key technical presentations from the international conference circuit
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